原産地: | 中国(本土) | 銘柄: | hb | モデル番号: | HB-PCL-10L-B | クリーニングのタイプ: | プラズマ洗浄 | 特徴: | 重大なクリーニング/残余は放す | 力(W): | 200-400ワット | 機械タイプ: | 他の | 材料: | ガラス/陶磁器 | 使用される企業: | エレクトロニクス産業 | 条件: | 新しい | 認証: | UL, CE | 使用: | 表面改質治療の基板、粒状材料 | 提供される売り上げ後のサービス: | 利用できるエンジニア機械類を海外に整備するため | 名前: | ウェハクリーニング | 容量: | 10l | 周波数オフセット: | 未満0.2 Khz | 表示モード: | 液晶 | ガス流量: | 10-100ミリリットル/分 |
包装
包装: | 木製ケース |
Multi-function laboratory plasma wafer cleaning
Application of wafer cleaning
1.Car industry: ignition coil engine oil seal film
2.Defense industry: Aerospace electrical connectors,Kevlar deal
3.Electronics industry: hard plastic parts, earphone, Cell phone cover
4.Medical industry: intravenous infusion, catheter treatment
5.Textile fiber,rubber and plastic industry and etc
Featrues of wafer cleaning
1. Environmental technologies: plasma process is the role of gas - solid coherent reactor consumes no water resources, no need to add chemicals and no environmental pollution.
2. Wide adaptability: regardless of processing substrate type, such as metals, semiconductors, oxides, and most of the polymer material can be a good deal;
3. Low temperature: close to room temperature, particularly suitable polymer materials, have a longer retention time and a higher surface tension than the corona and flame method.
4. Multifunctions: it involves only a shallow surface of polymer materials (10 -1000A), while preserving the characteristics of the material itself can give it one or more new features;
5. Low cost: the device is simple, easy operation and maintenance, continuous operation,a few bottles of gas can replac thousands of kilograms cleaning fluid
6. The whole process technology can be controlled: all the parameters can be setted by the computer and data recording
7. Treated geometry Unlimited: Big or small, simple or complex, parts or textiles can be processed.
Technical parmaters of wafer cleaning
Model | HB-PCL-10L-B |
Working current: | Total working current not higher than 2A (Not include the vacuum pump) |
RF frequency | 13.56MHz |
RF power | 200-400W |
Frequency offset | <0.4KHz |
Vacuum degree | 60Pa-100Pa |
Cleaning time | 1-6000s adjustable |
Gas flow | >10-100ml |
Process Control | manually/automatic |
Power | 10-100%adjustable |
Cleaning capacity | 10L |
Exhaust pipe | KF vacuum flange+vacuum aluminum pipe |
Vacuum Pump | Bipolar direct rotary vane pump |
Impedance matching | automatic |
Display | LCD |
Power supply | AC 220V 60Hz |