| 原産地: | 中国(本土) | 銘柄: | oem | モデル番号: | pcb |
包装
| 包装: | 葛パッケージ |
- Material: FR-4
- Number of layers: 8 layers
- Size: 18" x 16"
- Board thickness: 84.6-98.4MIL
| Product Technic Parameter | |||
| Item | Parameter | ||
| Double sided | Multilayer | ||
| Number of Layers | 2 | 4~12 | |
| Copper Thickness | 0.25~3.0OZ | 0.5~3.0OZ | |
| base Board Thickness | 0.3~3.2mm | 0.6~3.2mm | |
| Incombustibility | 94V-0 | 94V-0 | |
| Peelable resistance | 12.3N/cm | 12.3N/cm | |
| Twist | ≤0.5% | ≤0.5% | |
| Insulation resistance | ≥1011Ω | ≥1011Ω | |
| Test voltage | 10-300V | 10-300V | |
| Finished board area | 560×970mm | 560×970mm | |
| Min. Line Width and Spacing | 0.1/0.1mm | 0.1/0.1mm | |
| Copper thickness in hole | ≥25.0um | ≥25.0um | |
| Mini. pad diameter | Inner layer | 0.05mm | |
| Out layer | 0.076mm | 0.076mm | |
| Mini. Hole Diameter | 0.25mm | 0.20mm | |
| Hole tolerance | PTH | ±0.076mm | ±0.076mm |
| NPTH | ±0.05mm | ±0.05mm | |
| Hole location tolerance | ±0.076mm | ±0.05mm | |
| profile tolerance | Routing | ±0.1mm | ±0.1mm |
| Punching | ±0.13mm | ±0.13mm | |
| Solder mask bridge ability | ≥0.1mm | ≥0.075mm | |
| Solder mask rigidity | 6H | 6H | |
| Solderable test | 245 5 second | 245 5 second | |
| Thermal cycling ability | 288 10 second | 288 10 second | |
| Surface Finishing | OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger | OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger | |
| Qaulity standard | IPC-A-600F IPC-ML-950 | IPC-A-600F IPC-ML-950 | |
| Sample standard | STD-105E- | STD-106E- | |
