原産地: | 中国(本土) | 銘柄: | uniquestar | モデル番号: | Uns-01 |
Min.穴径: | 0.3 | Min.線幅: | 0.2 | 基材: | 用小型カメラ- 1 | 表面の仕上げ: | hal | Min.行送り: | 0.2 | 板厚さ: | 1.0 | 銅の厚さ: | 1オンス | 携帯充電器、 pcb( 電子pcb): | 回路基板 |
包装
Mobile charger pcb (electronic pcb):
PCB Product Technic Parameter |
Item
| Parameter |
Double sided | Multilayer |
Number of Layers | 2 | 4~12 |
Copper Thickness | 0.25~3.0OZ | 0.5~3.0OZ |
base Board Thickness | 0.3~3.2mm | 0.6~3.2mm |
Incombustibility | 94V-0 | 94V-0 |
Peelable resistance | 12.3N/cm | 12.3N/cm |
Twist | ≤0.5% | ≤0.5% |
Insulation resistance | ≥1011Ω | ≥1011Ω |
Test voltage | 10-300V | 10-300V |
Finished board area | 560×970mm | 560×970mm |
Min. Line Width and Spacing | 0.1/0.1mm | 0.1/0.1mm |
Copper thickness in hole | ≥25.0um | ≥25.0um |
Mini. pad diameter | Inner layer | | 0.05mm |
Out layer | 0.076mm | 0.076mm |
Mini. Hole Diameter | 0.25mm | 0.20mm |
Hole tolerance | PTH | ±0.076mm | ±0.076mm |
NPTH | ±0.05mm | ±0.05mm |
Hole location tolerance | ±0.076mm | ±0.05mm |
profile tolerance | Routing | ±0.1mm | ±0.1mm |
Punching | ±0.13mm | ±0.13mm |
Solder mask bridge ability | ≥0.1mm | ≥0.075mm |
Solder mask rigidity | 6H | 6H |
Solderable test | 245 5 second | 245 5 second |
Thermal cycling ability | 288 10 second | 288 10 second |
Surface Finishing | OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger | OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger |
Qaulity standard | IPC-A-600F IPC-ML-950 | IPC-A-600F IPC-ML-950 |
Sample standard | STD-105E- | STD-106E- |