製品情報
| 原産地: 中国(本土) | 銘柄: kf | モデル番号: Kf-fpc |
| 基材: π | 銅の厚さ: 1オンス | 板厚さ: 0.2mm |
| Min.穴のサイズ: 0.2mm | Min.線幅: 0.1mm | Min.行送り: 0.1mm |
| 表面の仕上げ: enig | はんだマスク: 黄色 | シルクスクリーン: 白 |
| 証明書: rohs指令、 iso、 ul | pcbのサイズ: カスタマイズされた | サンプル時間: 24時間、 48時間、 96時間。。。 |
| delieveryの時間: 4-5days | 船積みの方法: dhl、 フェデックス。。。 | パッキング: 真空包装 |
| アプリケーション: 電子 |
包装
| 包装: 真空密封包装、 シリカゲル内部。 |
仕様
リジッドフレキシブルpcb、 プリント回路基板fpc、 フレキシブルpcb1.ul、 sgs、 rohs認証取得2.競争力のある価格、 良いサービス
Welcome to K.F PCB Factory:
We are professional PCB manufacturer with ten years experiences . Products range-single, double side ,multi-layer PCB ,flexible PCB and MCPCB.
We can provide fast prototype service – S/S in 24hrs , 4-8layers in 48-96 working hrs production time.
flexible strip pcb,flexible metal core pcb assembly smt pcba.
Product DescriptionOur products:
Flexible Capability | ||
| No | Item | Technical data |
| 1 | Flexible layers | 1~8layer |
| 2 | Minimum Trace and Space | 12&18um(base Cu):0.075/0.075mm ;35um(base Cu):0.1/0.1mm |
| 3 | Minimum Space Betw en Coverlay Openings | 0.2mm |
| 4 | Edge of Coverlay Opening to Trace | 0.20mm(preferred) |
| 5 | Minimum Space between coverlay and solder pad | 0.15mm |
| 6 | Polyimide Films | 0.5 mil (12.5), 1 mil (25), 2 mils (50), 3 mils (75), 4mils(100), 5 mils(125) as custmer requested |
| 7 | Thermobond Adhesives | Acrylic/Modified Acrylic, Modified Epoxy, Polyimide |
| 8 | Copper Foils (RA or ED) | 1/3oz (12), 1/2oz (18), 1oz (35), 2oz (70) |
| 9 | Stiffeners | Polyimide, rigid FR4, PSA, metal, or customer supplied&requested |
| 10 | FR-4 in Multi-layer Flex Circuits | Laminated to flex circuit to create rigid flex boards, typically with vias. |
| 11 | Surface Finish | Electroless Ni/Au, Electrolytic soft/hard gold, Tin plating,,Imm.Tin,Entek/OSP |
| 12 | Solder Resists | Coverlay, Photo-Imagable Resist |
| 13 | Hole tolerance | ±0.05mm |
| 14 | Smallest Drill Size | 0.2mm |
| 15 | Largest Drill Size | 6.35mm |
| 16 | Smallest Slot Width | 0.35mm |
| 17 | Min.space between holes | 0.15mm |
| 18 | Minimum conductor edge to outline edge | ≥0.1mm |
| 19 | Minimum space between coverlay and conductor | ± 0.15mm |
| 20 | Hole to outline edge | ≥ 0.10mm |
| 21 | Tooling tolerances | Knife(Soft) tooling : ± 0.25mm |
| Steel(Hard) tooling : ± 0.05mm | ||
| CNC drill/rout : ± 0.10mm | ||
| 22 | Maximum Layer to Layer Mis-registration | ± 0.10mm |
| 23 | Copper Plated Thickness(PTH only) | 8~15um;20~30um;30~70um(special) |
| 24 | Au thickness | Electroless Ni/Au Ni:2~6um;Au:0.035~0.075um Electrolyticsoft/hardgoldNi:2~9um;Au:0.035~0.1um |
